Types of reflow ovens Reflow oven

a convection industrial reflow oven.

oven contains multiple zones, can individually controlled temperature. there several heating zones followed 1 or more cooling zones. pcb moves through oven on conveyor belt, , therefore subjected controlled time-temperature profile.

the heat source ceramic infrared heaters, transfers heat assemblies means of radiation. ovens use fans force heated air towards assemblies (which used in combination ceramic infrared heaters) called infrared convection ovens.

some ovens designed reflow pcbs in oxygen-free atmosphere. nitrogen (n2) common gas used purpose. minimizes oxidation of surfaces soldered. nitrogen reflow oven takes few minutes reduce oxygen concentration acceptable levels within chamber. nitrogen ovens typically have nitrogen injection in @ times decreases defect rates.

vapour phase oven

the heating of pcbs sourced thermal energy emitted phase transition of heat transfer liquid (e. g. pfpe) condensing on pcbs. liquid used chosen desired boiling point in mind suit solder alloy reflowed.

some advantages of vapour phase soldering are:

high energy efficiency due high heat transfer coefficient of vapour phase media
soldering oxygen-free. there no need protective gas (e.g. nitrogen)
no overheating of assemblies. maximum temperature assemblies can reach limited boiling point of medium.

this known condensation soldering.